Newsletter – PARMI

[vol.16] 2022年 5月

Printer Doctor 1. Real Time Printing Process Optimization PARMI 3D SPI SigmaX features a printer setup trouble …

Underfill Inspection 1. Underfill Inspection Underfill is a method of completely filling the bottom of …

Bottom Side Inspection 1. Xceed BSI Xceed BSI (Bottom Side Inspection) is a 2D & 3D AOI machine that inspe …

Multi-Lines Verification 1.Veriworks A program for 2nd judgement of defects identified by the inspection machi …

AI Auto Teaching 1.AI Auto Teaching Customers introducing AOI inspection to their facility will spend a …

Solder Bump Inspection 1.Solder Bump Inspection Solder bump is a conductive bump that connects a chip o …

💌 HAPPY NEW YEAR! 2020 is the year we started publishing PARMI newsletter. From the first newsletter in April …

Inspection of Lead Lift of IC in Tray 1.Lead Lift of IC (Integrated Circuit) Components Among the SMT devices, …

Chip Component Teaching Automation 1.What is Component Teaching? Since the launch of our Xceed 3D AOI machine …

The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the s …