[vol.22] 2022年 11月
SPI-AOI Linkage Analysis Determining the root cause of a defect which occurred during the manufacturing proces …
Newsletter
[vol.21] 2022年 10月
Foreign Materials/Surface Contamination Inspection of PCB Assemblies 1. Foreign Materials/Surface Contaminatio …
[vol.20] 2022年 9月
LED Distance Measurement 1. LED Distance Measurement If a manufacturer pursues only a high amount of light wi …
[vol.19] 2022年 8月
PARMI Partners with Mactech PARMI, a global leader in the PCB inspection machine sector, has partnered with Ma …
[vol.18] 2022年 7月
PARMI MES Production environments require increasing levels of automation, standardization, and effici …
[vol.17] 2022年 6月
Solder Ball Inspection 1. Solder Ball Application Description Solder ball is a spherical solder that electric …
[vol.16] 2022年 5月
Printer Doctor 1. Real Time Printing Process Optimization PARMI 3D SPI SigmaX features a printer setup trouble …
[vol.15] 2022年 4月
Underfill Inspection 1. Underfill Inspection Underfill is a method of completely filling the bottom of …
[vol.14] 2022年 1月
Bottom Side Inspection 1. Xceed BSI Xceed BSI (Bottom Side Inspection) is a 2D & 3D AOI machine that inspe …
[vol.13] 2021年 10月
Multi-Lines Verification 1.Veriworks A program for 2nd judgement of defects identified by the inspection machi …