[vol.12] 2021年 7月
AI Auto Teaching 1.AI Auto Teaching Customers introducing AOI inspection to their facility will spend a …
Newsletter
[vol.11] 2021年 4月
Solder Bump Inspection 1.Solder Bump Inspection Solder bump is a conductive bump that connects a chip o …
[vol.10] 2021年 1月
💌 HAPPY NEW YEAR! 2020 is the year we started publishing PARMI newsletter. From the first newsletter in April …
[vol.9] 2020年 12月
Inspection of Lead Lift of IC in Tray 1.Lead Lift of IC (Integrated Circuit) Components Among the SMT devices, …
[vol.8] 2020年 11月
Chip Component Teaching Automation 1.What is Component Teaching? Since the launch of our Xceed 3D AOI machine …
[vol.7] 2020年 10月
The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the s …
[vol.6] 2020年 9月
AI OCR Text Inspection 1. What is AI OCR Text Inspection? Text inspection is the most basic and important insp …
[vol.5] 2020年 8月
PCB Warpage Measurement 1. What is “PCB Warpage Measurement”? PARMI provides a function to measure the warpage …
[vol.4] 2020年 7月
On-the-fly Debugging 1. What is “On-the-fly Debugging”? Sometimes, there are occasions that inline inspections …
[vol.3] 2020年 6月
Backup Pin 1. What is “Backup Pin”? Through the process of manufacturing, clamping, reflow, PCB can have fault …